产品简介
代理韩国UV膜 玻璃/晶圆切割300mm*100m 无残胶 无飞料
代理韩国UV膜 玻璃/晶圆切割300mm*100m 无残胶 无飞料
产品价格:¥1
上架日期:2017-09-01 16:32:40
产地:深圳
发货地:深圳
供应数量:不限
最少起订:1平方米
浏览量:1388
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详细说明
    加工定制 厚度 0.17 适用范围 玻璃切割 晶圆切割
    用途 玻璃保护膜 品牌 邦凯 材质 PO
    长度 200m 基材 PO 胶系 亚克力
    宽度 1200mm 颜色 半透明 系列 UV膜
    订货号 29909571 粘性 卷芯材质 PE
    型号 BK-HG3810 是否跨境出口货源
    颜色:透明 基材:pet/po 厚度:0.17(mm)
    延伸系数:100% 短期耐温性:NA(℃) 加工定制:是
    宽度:180/210/230/300/330(mm) 胶系:亚克力 长期耐温性:NA(℃)
    型号:BK-78315 适用范围:玻璃切割 晶圆切割 品牌:LINTEC

    我公司专业代理琳得科ADWILL D系列UV膜,用于玻璃,晶圆,基板,陶瓷片等产品的切割。产品线齐全,价格优势,欢迎来电咨询。

     

    Two types of back grinding tape are available. The "E series" which can be removed without placing stress on the wafer by decreasing adhesion by UV irradiation, and the "P series" which is non-UV type. In addition, there is the "S series" peeling tape.

     

    • D series (UV Curable Dicing Tape)

     

    Product Inbbbbation

    Si Wafer
    Base Material:PVC-PO

    • High Expandability
    • Antistatic
    • Anti-chipping
    • High Adhesion
    • Easy Pick Up

    Glass / Ceramics
    Base Material:PVC-PET

    • Standard

    Package Substrate
    Base Material:PO

    • Standard
    • Antistatic

    Stealth Dicing
    Base Material:PVC-PO

    • Standard

    Wafer with LC Tape
    Base Material:PO

    • Standard

     

    Adwill D series is an epoch-making line of UV curable dicing tapes whose features can be changed in accordance with operational process. The tape's strong adhesion secures wafers during dicing, and then is reduced by UV irradiation to facilitate pick-up. This dicing tape is essential for full-cut dicing of wafers to improve die quality, and fully applicable to dies of multiple sizes.

    1. Secures wafers with strong initial adhesion to ensure dicing without any slipping or peeling even for small dies.
    2. Supports instant control of adhesion by UV irradiation, allowing large dies to be picked up easily.
    3. Causes no contamination by bbbbl ions or by adhesive residue on the wafer backside surface, and no adverse UV irradiation effects on ICs.
    4. Prevents contact damage of dies with superb expandability, which is not reduced by UV irradiation.
    5. Offers a variety of tape grades ranging from a tape with reduced tape chips at high speed, full-cut dicing to a special tape for thin wafers.
    6. Provides special grades not only for wafer dicing but also for package, ceramic or glass dicing.
    7. Provides various not only for blade dicing but also for laser dicing.
    8. Supports the adhesive coating process environment that meets Class 100 (ANSI 209b) standards.

    ount tape Adwill D-series specification

    Name of tape

    D-105V

    D-203

    D-210

    D-218

    D-410T

    D-510T

    D-511T

    D-628

    D-636

    D-636 (LM001B)

    D-650

    D-667

    D-670

    D-675

    D-820

    Tape thickness (um)

    90

    65

    125

    203

    130

    170

    170

    90

    155

    95

    90

    90

    90

    90

    110

    Face material / Thickness (um)

    PVC / 80

    PET / 50

    PET / 100

    PET / 188

    PO / 100

    PO / 140

    PO / 140

    PO / 80

    PO / 140

    PO / 80

    PO / 80

    PO / 80

    PO / 80

    PO / 80

    PVC / 100

    Color

    Blue

    Transparent

    Transparent

    Transparent

    bbbbb

    bbbbb

    bbbbb

    bbbbb

    bbbbb

    bbbbb

    bbbbb

    Transparency

    bbbbb

    bbbbb

    Blue

    Adhesive layer / Thickness (um)

    Acrylic / 10

    Acrylic / 15

    Acrylic / 25

    Acrylic / 15

    Acrylic / 30

    Acrylic / 30

    Acrylic / 30

    Acrylic / 10

    Acrylic / 15

    Acrylic / 15

    Acrylic / 10

    Acrylic / 10

    Acrylic / 10

    Acrylic / 10

    Acrylic / 10

    Before UV adhesion (g/inch)

    400

    2000

    2000

    1600

    2000

    2300

    1200

    1000

    1400

    1200

    350

    400

    400

    200

    340

    After UV adhesion (g/inch)

    35

    15

    20

    25

    70

    80

    30

    10

    65

    100

    10

    60

    60

    20

    75

    Holding power (sec.)

    10000

    3000

    50000

    3000

    50000

    50000

    >70000

    >70000

    50000

    50000

    >70000

    >70000

    >70000

    >70000

    >70000

    25% strength MD (kg/cm)

    0.8

    6

    12

    >15

    1

    1.25

    1.25

    0.8

    1.25

    0.8

    0.8

    0.8

    0.8

    0.8

    0.7

    25% strength CD (kg/cm)

    0.7

    6

    12

    >15

    0.9

    1.2

    1.2

    0.7

    1.2

    0.7

    0.7

    0.7

    0.7

    0.7

    0.6

    Tensile strength MD (kg/cm2)

    285

    1500

    2000

    >1000

    320

    350

    350

    340

    350

    320

    340

    340

    340

    340

    250

    Tensile strength CD (kg/cm2)

    225

    1500

    2000

    >1000

    260

    340

    340

    280

    340

    270

    280

    280

    280

    280

    200

    Elongation MD (%)

    295

    120

    100

    >50

    480

    570

    570

    450

    570

    450

    450

    450

    450

    450

    300

    Elongation CD (%)

    285

    120

    100

    >50

    530

    620

    620

    500

    620

    500

    500

    500

    500

    500

    200

    Expandability

    Excellent

    No good

    No good

    No good

    No good

    No good

    No good

    No good

    No good

    Fair

    No good

    Fair

    Fair

    Good

    Excellent

    Suitable chip size

    >2X2mm

    >1X1mm

    >1X1mm

    >1X1mm

    >0.5X0.5mm

    >0.5X0.5mm

    >0.5X0.5mm

    >0.5X0.5mm

    >0.5X0.5mm

    >0.5X0.5mm

    >1X1mm

    >1X1mm

    >1X1mm

    >2X2mm

    >2X2mm

    Guarantee period (Mon.)

    4

    6

    6

    6

    5

    5

    5

    5

    5

    5

    8

    5

    5

    5

    2

    Remark

    Expandable tape

    For glass & ceramic dicing

    For glass & ceramic dicing

    For glass & ceramic dicing

    For package dicing (CSP, BGA)

    For package dicing (CSP, BGA)

    For package dicing (CSP, BGA)

    For small chip dicing

    For small chip dicing

    For small chip dicing

    For LOC package, Low adhesive residue

    Standard dicing tape

    Standard dicing tape

    Standard dicing tape

    Anti-static dicing tape


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